Dɛn Nti na Wo Polishing Pads Wu Wɔ Nnɔnhwerew Abien akyi? 4 Ntease Ankasa

Wotɔ batch foforo a ɛyɛ mmerɛw polishing pads. Wɔyɛ adwuma yiye dɔnhwerew a edi kan no. Edu dɔnhwerew a ɛto so abien no, gloss no so tew, ɔhyew da adi, na woresakra ntwahonan bio. Eyi nyɛ ade a ɛfata. Nneɛma anan ankasa nti a wo pads rewuwu ntɛmntɛm dodo ni.

Nea enti a ɛte saa: Wo bond hardness no ne wo tile no nhyia.

Nneɛma a ɛma ɛyɛ mmerɛw sɛ ɛbɛkyekyere diamond no gyae diamond aba ntɛmntɛm dodo. Nneɛma a ɛyɛ den a wɔde kyekyere aburow no kura aburow no mu kyɛ dodo, na ɛma ɛyɛ kusuu koraa ansa na ahwe ase. Either extreme kum wo pad nkwa. Bond hardness a ɛfata no gyina wo tile no density ne wo line ahoɔhare so. Yɛde bond hardness hyia wo nneɛma pɔtee, ɛnyɛ one{4}}size-fits-all formula.

Nea enti a ɛte saa: Wo coolant flow no sua dodo anaasɛ ɛho agu fĩ dodo.

Diamond磨块 ma ɔhyew kɛse ba. Sɛ wuannya nsu a ɛma onwini a ɛdɔɔso a, resin bond no yɛ mmerɛw na w’aburow no hwe ase ntɛm. Sɛ wɔde coolant a ɛho agu fĩ di dwuma a, pad no mu ntini siw na ɔhyew no boaboa ano wɔ pad no mu sen sɛ ɛbɛhohoro. Hwɛ wo flow rate na filter daa. Filtration upgrades a ɛho ka sua no taa tua wɔn ho wɔ dapɛn biako a wɔde sie pad mu.

Nea enti a ɛte saa: Woretu mmirika wɔ spindle ahoɔhare a ɛnteɛ so.

Pad grade biara wɔ ahoɔhare a eye sen biara. Mmirikatu ntɛmntɛm dodo ma friction heat a ɛma bond no yɛ mmerɛw. Mmirikatu a ɛyɛ brɛoo dodo no brɛ adeyɛ a wɔde twa ade no ase, na ɛhyɛ wo ma wode nhyɛso pii ba, na afei ɛpaapae pad no akyi. Bisa wo supplier no ahoɔhare a ɛwɔ grit grade biara mu. Yɛtintim saa range yi wɔ adaka biara so.

Nea enti a ɛte saa: Wo pad a atwam no de ɔsɛe a ahintaw bae.

Eyi ma adetɔfo dodow no ara ho dwiriw wɔn. Sɛ wo pad a etwa to no mu paapae anaasɛ ɛpaapaee a, ebia na agyaw abrasive residue wɔ wo mfiri no akyi mprɛte no so. Saa nkae yi ma mmeae a ɛkorɔn a ɛtow wo pad foforo no wɔ simma kakraa bi mu. Siesie wo backing plate no yiye ansa na wode pads foforo ahyɛ mu.

Nsiesiei no yɛ nea wontua hwee.

Ansa na wobɛtɔ pads pii no, hwɛ wo coolant no mu, tew wo prɛte no ho, na si so dua sɛ wode ahoɔhare tu mmirika. Sɛ ɔhaw kɔ so a, fa wo pads a asɛe no mfonini mena yɛn. Yɛbɛhwehwɛ huammɔdi nhyehyɛe no na yɛakamfo bond formula a wɔateɛteɛ akyerɛ.